Engineering Example

Heat-Shield Attachment Optimization

Balancing structural performance, thermal management, and material efficiency through multi-objective optimization.

Multi-Objective

Stress, stiffness, and temperature balanced simultaneously.

Coupled Physics

Fully coupled thermomecihanics with pressure-dependent thermal contact.

Material Efficiency

High performance within a fixed material volume constraint.

The Engineering Challenge

A high-temperature component is supported by a lightweight attachment that must transfer mechanical loads and conduct heat to a cooled mounting structure. The design must minimize stress, deformation, and operating temperature while satisfying a strict material constraint.

Structural Loads

Carry applied pressure and transfer loads to the mounting structure.

Thermal Management

Conduct heat away from the component to the cooled mounting structure.

Weight Constraint

Meet performance objectives within a fixed material budget.

Why This Problem is Difficult

Increase Stiffness

Increase Weight

Reduce Temperature

Increase Conduction

Reduce Stress

Redistribute Material

Every design change influences all three objectives simultaneously.

The Optimized Design

The optimized design naturally develops efficient load paths and a dedicated thermal path.

Two structural legs carry loads from the component interface, wrap around the attachment points, and triangulate back to the mounting structure.

A thicker central column provides a low-resistance conduction path that transfers heat to the cooled structure.

Structural Load Path
Side View

Material aligns along the primary load paths to transfer pressure into the mounting structure efficiently.

Heat Conduction Path
Top View

A continuous central pathway forms to conduct heat from the heated interface to the cooled mounting structure.

Joint Geometry
Front View

Material is placed where contact pressure is highest, maximizing both structural support and thermal conductance.

Overall Configuration
Oblique View

The final design balances structural and thermal objectives within the fixed material volume.

Why This Solution Works

The design balances thermal and structural performance. Heat flows primarily through the central column, keeping the structural members cooler.

Performance Objectives

01. Reduce Stress

Material is concentrated along principal load paths to minimize peak stress.

Triangulated structural members maximize stiffness with minimal material.

A continuous conduction path connects the heated interface to the thermal sink.

Topology optimization meets all objectives within the fixed volume constraint.

Engineering Insight

Pressure-dependent thermal contact

Thermal contact conductance depends on contact pressure. The optimizer places material so that regions that perform thermal work are also held in firm compression, where conductance is highest. Without modeling this effect, the design would rely on heat crossing lightly loaded or open regions, and real-world performance would degrade.

Model Capability Snapshot

Physics

Fully Coupled Thermomechanics

Contact

Pressure-Dependent Thermal Contact

Objectives

Stress, Stiffness, Temperature

Method

Density-Based Topology Optimization (SIMP)

Optimization

Adjoint Sensitivities + MMA

Constraint

Fixed Material Volume

Mesh

~338k Elements (~68k Nodes)

DOF

~273k (4 per node)

Runtime

~3 Hours on 8-Core Workstation

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